Welcome to the official website of 2026 the 9th International Conference on Smart Materials Applications (ICSMA 2026). The Conference will be held at Tokyo University of Science, Tokyo, Japan during January 28-30, 2026. ICSMA2026 is co-organized by South Asia Institute of Science and Engineering (SAISE); Tokyo University of Science, Japan; Yonsei University, South Korea and Sichuan University, China. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.

Conference Proceedings All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, Indexed by Elsevier: SCOPUS. Call for Papers Topics of interest for submission include, but are not limited to: Materials Science and Engineering, Materials Properties, Measuring Methods and Applications, Methodology of Research and Analysis and Modeling, Materials Manufacturing and Processing. More information plz visit http://www.icsma.org/ Submission Link http://confsys.iconf.org/submission/icsma2026 Page Requirements Each paper should have no less than 5 pages normally, including all figures, tables, and references. One regular registration is within SIX Pages. Extra pages will be charged. For any inquiry about the conference, please feel free to contact Ms. Loey Liu Conference Secretary of ICSMA Email: icsma@saise.org Tel: +852-36789835 (Hong Kong) / +86-15008402564 (China) (Office Time 9:30 – 18:00, Time zone: UTC+8; Monday to Friday)