2026 9th International Conference on Materials Design and Applications (ICMDA 2026) will be held in Tohoku University, Sendai, Japan during April 17-20, 2026.

ICMDA focus on fundamental research and application areas in the field of the design and application of engineering materials, predominantly within the context of mechanical engineering applications such as automobile, railway, marine, aerospace, biomedical, pressure vessel technology, turbine technology, etc. This includes a wide range of materials engineering and technology, including metals, e.g., lightweight metallic materials, polymers, composites, and ceramics. Advanced applications would include manufacturing in the new or newer materials, testing methods, multi-scale experimental and computational aspects (e.g. micro- and nano-scale techniques).

* Publication
Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection.
Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507)
Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779)
Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752)
Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795)
Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.

* History
ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7-Online Linkage | Indexed by Scopus
ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7-Online Linkage | Indexed by Scopus
ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7-Online Linkage | Indexed by Scopus
ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus
ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7-Online Linkage | Indexed by Ei Compendex & Scopus
ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9-Online Linkage | Indexed by Ei Compendex & Scopus
ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0-Online Linkage | Indexed by Ei Compendex & Scopus

* Conference Committee
Conference Chairs:
Osamu Tabata, Kyoto University of Advanced Science, Japan
Takashige Omatsu, Chiba University, Japan

Program Chairs:
Masahiro Nomura, The University of Tokyo, Japan
Kwang Leong Choy, Duke Kunshan University, China

Program Co-Chairs:
Yoshio Kobayashi, Ibaraki University, Japan
Anatoly Zinchenko, Nagoya University, Japan
……
More info about conference Committees: https://icmda.org/com.html

* Submission Method
System Submission: https://confsys.iconf.org/submission/icmda2026
Email Submission: icmda@cbees.net
For more details, you can learn through: https://icmda.org/sub.html

* Call for Paper
-Materials Properties, Measuring Methods and Applications
Creep-resistance
Fracture Mechanics
Mechanical Propertie

-Materials Analyses and Modeling
Electron Microscopy
Artificial Intelligence Methods
Computational Material Science

-Materials Science and Materials Processing Technology
Optical / Electrical / Magnetic Materials
Environmental-Friendly Materials
Surface Engineering / Coatings Technology
For more topics, please visit: http://www.icmda.org/cfp.html

* Contact Us
Conference Secretary: Ms. Lynn
Email: icmda@cbees.net
Tel: +852-3155-4897/+86-28-87577778
Working Time: Monday – Friday; 9:30-18:00 (UTC/GMT+08:00)