※Paper Publication
1. EEET Conference Proceedings: submitted for indexing by Ei Compendex and Scopus.
2. International Journal of Electrical and Electronic Engineering & Telecommunications (IJEETC, ISSN: 2319-2518): indexed in Scopus (since 2017), Google Scholar, Crossref, Citefactor, etc.

Since 2018, EEET conference proceedings have been published in EEET internation conference proceedings and indexed by Ei Compendex and Scopus.

※History
EEET 2018丨Tianjin, China丨ISBN: 978-1-4503-6541-3
EEET 2019丨Penang, Malaysia丨ISBN: 978-1-4503-7214-5
EEET 2020丨Kitakyushu, Japan丨ISBN: 978-1-4503-8756-9
EEET 2021丨Nanjing, China丨ISBN: 978-1-4503-8516-9
EEET 2022丨Beijing, China丨ISBN-979-8-3503-2042-8
EEET 2023丨Nanjing, China丨ISBN: 979-8-3503-9559-4
EEET 2024丨Malacca, Malaysia丨ISBN: 979-8-3315-2786-0 (in press)

※Topics
Track 1: Electronics & Semiconductor Technology
Track 2: Electrical Engineering & Sustainable Energy
Track 3: Communication & Computer Engineering
Track 4: Robotics, Industrial Automation & Instrumentation
Track 5: Cybersecurity and Data Privacy
Track 6: Artificial Intelligence and Machine Learning
For more information, please visit：http://www.eeet.org/cfp.html

※Call for participants
1. EEET 2025 welcomes participant include authors and listeners. Listener Registration: http://confsys.iconf.org/register/eeet2025.
2. EEET 2025 is recruiting Technical Program Committee and Invited Speakers. If you are interested in it, please send your CV to the email box: eeet@siit.ac.cn.

Conference Highlights
1. Campus Tour: Chiba University
2. Chiba City Tour

Submission and Contact Methods
Submission Methods:
Submission System: http://www.easychair.org/conferences/?conf=eeet2025
Submission E-mail: eeet@siit.ac.cn
Tel: +86-18000595361
Conference Secretary: Ms. Ruby He