About this event

Publication
The registered and presented papers will be published in Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752), which will be indexed by Ei Compendex, Scopus.

Publication History
ICSMM 2021     Materials Science Forum-ISBN: 978-3-0364-0024-2 (publication in progress…)
ICSMM 2020     Key Engineering Materials: Volume 891. [ISBN: 978-3-0357-1789-1] (Ei Compendex & Scopus)
ICSMM 2019     Solid State Phenomena: Volume 305. [ISBN: 978-3-0357-1657-3] (Ei Compendex & Scopus)
ICSMM 2018     Material Science Forum: Volume 962. [ISBN: 978-3-0357-1416-6] (Ei Compendex & Scopus)
ICSMM 2017     IOP Conference Series: Materials Science and Engineering, VoL.311. (Ei Compendex & Scopus)

Submission Methods
Two kinds of proposals are accepted: Abstract for oral presenation & Full paper for publication and oral presentation.(English Only)
* System submission: http://confsys.iconf.org/submission/icsmm2022
* Email submission: icsmm@cbees.net
For submission guidline, please visit: http://www.icsmm.org/sub.html

Conference Topics
* New Materials and Advanced Materials
* Electronic Materials
* Sensor Technology
* Materials Processing Engineering
* Material Chemistry
* Manufacturing Processes and Systems
For more topics, please visit: http://www.icsmm.org/cfp.html

Contact us
Ms. Elva Zhang
Tel: +86-28-87577778
E-mail: icsmm@cbees.net
Website: www.icsmm.org