※Paper Publication

1.Conference Publishing Services (CPS): included into IEEE Xplore, and submitted for indexing by Ei Compendex and Scopus.

2.International Journal of Electrical and Electronic Engineering & Telecommunications (IJEETC, ISSN: 2319-2518), indexed by Scopus, Google Scholar, etc.

Special Issue: Sensors (ISSN: 1424-8220, IF: 3.9, Cite Score: 6.8), indexed by Scopus, SCIE (Web of Science), PubMed, Embase, Ei Compendex, Inspec, etc.

Since 2018, EEET papers have been published indexed by Ei Compendex and Scopus.

※History

EEET 2018丨Tianjin, China丨ISBN: 978-1-4503-6541-3

EEET 2019丨Penang, Malaysia丨ISBN: 978-1-4503-7214-5

EEET 2020丨Kitakyushu, Japan丨ISBN: 978-1-4503-8756-9

EEET 2021丨Nanjing, China丨ISBN: 978-1-4503-8516-9)

EEET 2022丨Beijing, China丨ISBN-13: 979-8-3503-2042-8)

※Topics

Track 1: Radar Imaging and Information Extraction

Track 2: Materials, Devices and Applications of Spintronics

Track 3: Materials, Devices and Applications of Flexible Electronics and Intelligent Systems

Track 4: Materials and Devices of New Energy

Other topics include but are not limited to the following:

Electronics, Power Engineering, Control and Computer Systems, Telecommunication Engineering, Computer Engineering, Imaging and Sensor Engineering

for more information, please visit：http://www.eeet.org/cfp.html

※Call for participants

1. EEET 2023 welcomes participant include authors and listeners. Listener Registration: http://confsys.iconf.org/register/eeet2023.

2. EEET 2023 is recruiting Committee members and Invited Speakers. If you are interested in it, please send your CV to the email box: eeet@siit.ac.cn.

Submission and Contact Methods

Submission Methods

Submission System: http://www.easychair.org/conferences/?conf=eeet2023

Submission E-mail: eeet@siit.ac.cn

Tel:  +86-18000595361

Conference Secretary: Ms. Doris Liu