About this event
All papers will be strictly double blind reviewed by the program committee, and accepted papers after proper registration and presentation will be published in the International Conference Proceedings Series by ACM (ISBN: 978-1-4503-9584-7), which will be archived in the ACM Digital Library, and indexed by Ei Compendex, Scopus, etc.
Prof. Yonghui Li, IEEE Fellow, The University of Sydney, Australia
Prof. Rui Zhang, IEEE Fellow, National University of Singapore, Singapore
Prof. (Kit) Kai-Kit Wong, IEEE Fellow, University College London, UK
Assoc. Prof. Rohaya Latip, University Putra Malaysia, Malaysia
Assoc. Prof. Hugo G. Gonzalez-Hernandez, Tecnológico de Monterrey, México
Assoc. Prof. Wael Mohamed Shaher Yafooz, Taibah University, Saudi Arabia
Assoc. Prof. Indrarini D. Irawati, Telkom University, Indonesia
3D Process and Integration Technologies
Substrate Embedding & Advanced Flip-Chip Packaging
MEMS & Sensor Technologies
Wafer-Level CSP & Heterogeneous Integration
Design and Analysis of Power Delivery Systems…etc
1. Submission Requirements
English is the official language of the conference. The paper should be written and presented only in English.
♦ Publication & Presentation
Full paper (at least 8 pages) submission is required if you consider publishing your paper.
♦ Presentation Only
Abstract (200-400 words) submission is acceptable for presentation only at ICECC 2022.
Each paper should have 8 pages at least. A regular registration can cover a paper within 10 pages and more pages will be charged at 60 USD/page. Please well format your paper according to the template before submission.
♦How to submit?
Send to official email directly: email@example.com. or submit via Online submission system: http://confsys.iconf.org/submission/icecc2022
Conference secretary: Ms. Reina Wang
Office Hour: 9:30-18:00
Monday to Friday (GMT+8)