2026 2nd International Conference on Advanced Semiconductors and Communications (ICASC 2026) will be held on May 8-10, 2026 in Shanghai, China.

Conference Website: https://ais.cn/u/NrANzq

—Call For Papers—

The topics of interest for submission include, but are not limited to:

◕Semiconductor manufacturing

Extreme ultraviolet lithography ( EUV ) technology

3D integrated circuit and its manufacturing process

Advanced packaging and testing technology

Semiconductor manufacturing process optimization and automation

◕Quantum computation and quantum communication

Quantum dot and quantum bit control

Quantum cryptography and secure communication

Quantum Networks and the Internet

Quantum computing hardware and chip design

◕Semiconductor materials and devices

New semiconductor materials ( such as silicon carbide, gallium nitride and two-dimensional materials )

Advanced CMOS Technology

High efficiency power semiconductor devices

Nanoscale electronic devices

◕Sensor and MEMS technology

Integrated micro-electro-mechanical system ( MEMS ) smart sensors and nano-sensors

Bioelectronic equipment and sensing technology

Environmental Monitoring and Health Management Sensors

◕Mobile communication technology

Mobile Edge Computing ( MEC )

Network slicing technology

Elastic network and adaptive communication

Internet of Vehicles ( V2X ) technology

◕Intelligent sensing and Internet of Things (IoT)

Internet of Things node and gateway design

Internet of things security and privacy

Edge computing and edge intelligence

Low Power Wide Area Network (LPWAN)

◕Data processing and transmission

High speed data link technology

Advanced coding and modulation technology

Data compression and transmission optimization

Fault tolerance and error correction technology

—Publication—

All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of ICASC 2026 will be published in the SPIE – The International Society for Optical Engineering (ISSN: 0277-786X) Conference Proceedings, and it will be submitted to EI Compendex and Scopus for indexing.

—Important Dates—

Full Paper Submission Date: March 27, 2026

Registration Deadline: April 3, 2026

Final Paper Submission Date: April 20, 2026

Conference Dates: May 8-10, 2026

— Paper Submission—

Please send the full paper(word+pdf) to Submission System:

https://ais.cn/u/NrANzq