Conference Proceedings
All full paper submissions will be blind reviewed on the basis of technical quality, relevance to conference topics of interest, originality, significance, and presentation. Accepted papers will be published into Conference Proceedings.

Publication History
ICBMC 2024 >> Vol. 983-Key Engineering Materials (KEM)-ISBN: 978-3-0364-0616-9 >> Indexed by Scopus
ICBMC 2023 >> Vol. 963-Key Engineering Materials (KEM)-ISBN: 978-3-0364-0434-9 >> Indexed by Scopus
ICBMC 2022 >> Vol. 1067-Materials Science Forum (MSF)-ISBN:978-3-0364-0133-1 >> Indexed by Scopus
ICBMC 2021 >> Vol. 896-Key Engineering Materials(KEM)-ISBN:978-3-0357-1892-8 >> Indexed by Ei Compendex & Scopus
ICBMC 2020 >> Vol. 829-IOP Conference Series: Materials Science and Engineering >> Indexed by Scopus
ICBMC 2019 >> Vol. 972-Materials Science Forum(MSF)-ISBN:978-3-0357-1530-9 >> Indexed by Ei Compendex & Scopus
ICBMC 2018 >> Vol. 371-IOP Conference Series: Materials Science and Engineering >> Indexed by Ei Compendex & Scopus

Conference Committees
Conference Chair:
Prof. Tan Kiang Hwee (IES/JCI/JSCE Fellow), National University of Singapore, Singapore

Conference Co-Chair:
Prof. Zongjin Li (ACI Fellow), Macau University of Science and Technology, China

Program Chairs:
Prof. Ippei Maruyama, The University of Tokyo, Japan & Nagoya University, Japan
Prof. Wei-Ting Lin, National Ilan University

Program Co-Chairs:
Assoc. Prof. S. Joseph Antony (RSC Fellow), University of Leeds, UK
Assoc. Prof. Eshrar Latif, Cardiff University, UK

Publicity Committees:
Assoc. Prof. Duy Nguyen Phan, Van Lang University, Vietnam
Assist. Prof. Yi Shen, Tongji University, China
Dr. Koorosh Gharehbaghi, RMIT University, Australia

Regional Chairs:
Prof. Bashir M Suleiman, University of Sharjah, UAE
Prof. Ludovic Jason, Université Paris Saclay, France
Prof. Zujian Huang, South China University of Technology, China

Award Chair:
Assoc. Prof. Alcestis Rodi, University of Patra, Greece
Looking forward to the Conference Committees in 2026!

Submission Method
1.You can submit your paper via submission system: http://confsys.iconf.org/submission/icbmc2026
2.Or directly send to the conference email box: icbmc@cbees.net

Conference Topics (but not limited to)
Topic 1: Architecture and Urban Planning
Architectural Design and Theories
Advanced Construction Materials
Aesthetics and Landscape
Architectural Design and Its Theory

Topic 2: Materials Science and Engineering
Metallic Alloys, Tool Materials
Superplastic Materials
Ceramics and Glasses
Composites

Topic 3: Civil and Structural Engineering
Bridge Engineering; Building Structure and Bridge Engineering
Building Technology; Cartography and Geographic Information System
Coastal Engineering; Computational Mechanics
Computer Simulation and CAD/CAE; Concrete Structures

Topic 4: Materials Properties, Measuring Methods & Applications
Ductility, Crack Resistance, Fatigue, Creep-resistance
Fracture Mechanics, Mechanical Properties
Electrical Properties, and Magnetic Properties
Corrosion, Erosion, Wear Resistance

Topic 5: Materials Manufacturing and Processing
Casting, Powder Metallurgy
Welding, Sintering, Heat Treatment
Thermo-Chemical Treatment
Thin & Thick Coatings
Please check the following link which you can find more topics: https://www.icbmc.org/cfp.html

Contact Us
Ms. Cynthia Song
Email: icbmc@cbees.net
Tel: +86-28-87577778(Mainland China) +852-3155-4897(Hong Kong)