10th International Conference on Smart Materials Applications (ICSMA 2027)

Brandon Urbum
10th International Conference on Smart Materials Applications (ICSMA 2027)
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Description

Conference Proceeding
All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, Indexed by Elsevier: SCOPUS.

Committees
Conference Committee Chairs
Prof. Kazuo Umemura, Tokyo University of Science, Japan
Prof. Jong Hak Kim, Yonsei University, South Korea
Prof. Xiaohong Zhu, Sichuan University, China

Program Committee Chairs
Assoc. Prof. Jung Tae Park, Yonsei University, South Korea
Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore
Dr. Seok-Keun Koh, C&G Hitech Co., Ltd, Korea

Call for Papers
(01) Smart & Functional Materials
(02) Material Properties & Characterization
(03) Manufacturing & Processing
(04) Computational & AI-Driven Approaches
(05) Applications & Sustainability
For more topics, please visit: https://www.icsma.org/cfp.html

Submission
Please upload your abstract/full paper to iconf. Submission System (http://confsys.iconf.org/submission/icsma2027). Any questions, please feel free to contact via [email protected].
1. Full Paper (Presentation and Publication)
Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceeding.
2. Abstract (Presentation only)
Accepted abstract will be invited to give the presentation at the conference, the presentation will not be published.
For more details, please visit: https://www.icsma.org/submission.html

Contact Us
Ms. Sia Fan
Email: [email protected]
Tel: +852-36789835 (Hong Kong) / +86-15008402564 (China)

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